ISO7520 datasheet(3/15 Pages) TI

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ISO7520

ISO7521

www.ti.com

SLLSE39 – JUNE 2010

THERMAL INFORMATION

ISO752xC

THERMAL METRIC

UNITS

16 PINS

qJA

Junction-to-ambient thermal resistance(1)

79.9

qJCtop

Junction-to-case (top) thermal resistance(2)

44.6

qJB

Junction-to-board thermal resistance(3)

51.2

°C/W

yJT

Junction-to-top characterization parameter(4)

18.0

yJB

Junction-to-board characterization parameter(5)

42.2

qJCbot

Junction-to-case (bottom) thermal resistance(6)

n/a

Device power dissipation, Vcc1 = Vcc2 = 5.25 V, TJ = 150°C, CL = 15 pF, Input a 0.5

MHz 50% duty cycle square wave

(1)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(2)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific

JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(3)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(4)

The junction-to-top characterization parameter, yJT, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining qJA, using a procedure described in JESD51-2a (sections 6 and 7).

(5)

The junction-to-board characterization parameter, yJB, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining qJA , using a procedure described in JESD51-2a (sections 6 and 7).

(6)

The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)

MIN

TYP

MAX

UNIT

VCC1, VCC2

Supply voltage - 3.3V Operation

3.15

3.3

3.45

Supply voltage - 5V Operation

4.75

5.25

IOH

High-level output current

–4

IOL

Low-level output current

VIH

High-level output voltage

VCC

VIL

Low-level output voltage

0.8

Ambient Temperature

-40

105

°C

(1)

Junction temperature

–40

136

°C

1/tui

Signaling rate

Mbps

tui

Input pulse duration

(1)

To maintain the recommended operating conditions for TJ, see the Package Thermal Characteristics table and the Icc Equations section

of this data sheet

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