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MCP2200 датащи(PDF) 18 Page - Microchip Technology |
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MCP2200 датащи(HTML) 18 Page - Microchip Technology |
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18 / 34 page ![]() MCP2200 DS22228A-page 18 2010 Microchip Technology Inc. TABLE 3-2: THERMAL CONSIDERATIONS Standard Operating Conditions (unless otherwise stated) Operating temperature -40 C TA +85C (I-Temp) Param No. Sym Characteristic Typ Units Conditions TH01 θJA Thermal Resistance Junction to Ambient 85.2 C/W 20-pin SOIC package 108.1 C/W 20-pin SSOP package TBD C/W 20-pin QFN 5x5mm package TH02 θJC Thermal Resistance Junction to Case 24 C/W 20-pin SOIC package 24 C/W 20-pin SSOP package 24 C/W 20-pin QFN 6x6mm package TH03 TJMAX Maximum Junction Temperature 150 C TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD(1) TH06 PI/O I/O Power Dissipation — W PI/O = (IOL * VOL) + (IOH * (VDD – VOH)) TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/θJA(2,3) Legend: TBD = To Be Determined. Note 1: IDD is the current to run the chip alone without driving any load on the output pins. 2: TA = Ambient Temperature. 3: TJ = Junction Temperature. |
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