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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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SPBT2532C2AT датащи(PDF) 18 Page - STMicroelectronics |
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SPBT2532C2AT датащи(HTML) 18 Page - STMicroelectronics |
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18 / 48 page  Soldering SPBT2532C2.AT 18/48 Doc ID 16089 Rev 3 9 Soldering Soldering phase has to be executed with care: In order to avoid undesired melting phenomenon, particular attention has to be taken on the set up of the peak temperature. Here following some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C, July 2004 recommendations. Figure 8. Soldering Table 7. Soldering Profile feature PB-free assembly Average ramp up rate (TSMAX to TP) 3°C / sec max Preheat Temperature min (TS min) Temperature max (TS max) Time (tS min to tS max) (tS) 150 °C 200 °C 60-100 sec Time maintained above: Temperature TL Time tL 217 °C 60-70 sec Peak temperature (TP) 240 + 0 °C Time within 5 °C of actual peak temperature (tP) 10-20 sec Ramp down rate 6 °C / sec Time from 25 °C to peak temperature 8 minutes max |
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