PROVISIONAL ISSUE D - AUGUST 2001

ZXMN6A09DN8

2

ABSOLUTE MAXIMUM RATINGS.

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-Source Voltage

V

DSS

60

V

Gate Source Voltage

V

GS

20

V

Continuous Drain Current (V

(V

(V

I

D

5.2

4.1

3.9

A

Pulsed Drain Current (c)

I

DM

17.6

A

Continuous Source Current (Body Diode) (b)

I

S

3.5

A

Pulsed Source Current (Body Diode)(c)

I

SM

15

A

Power Dissipation at T

Linear Derating Factor

P

D

1.25

10

W

mW/°C

Power Dissipation at T

Linear Derating Factor

P

D

1.81

14.5

W

mW/°C

Power Dissipation at T

Linear Derating Factor

P

D

2.16

17.3

W

mW/°C

Operating and Storage Temperature Range

T

-55 to +150

°C

THERMAL RESISTANCE

PARAMETER

SYMBOL

VALUE

UNIT

Junction to Ambient (a)(d)

100

°C/W

Junction to Ambient (a)(e)

69

°C/W

Junction to Ambient (b)(d)

58

°C/W

NOTES

(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper,

in still air conditions

(b) For a device surface mounted on FR4 PCB measured at t 10 secs.

(c) Repetitive rating 25mm x 25mm FR4 PCB, D=0.05 pulse width=10µs - pulse width limited by maximum

junction temperature.

(d) For device with one active die

(e) For device with two active die running at equal power.