PCF8531 datasheet(5/44 Pages) NXP

номер детали	PCF8531

подробное описание детали	34 x 128 pixel matrix driver

PDF	44 Pages

Scroll/Zoom	100%

производитель	NXP [NXP Semiconductors]

домашняя страница	http://www.nxp.com

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5 / 44 page

PCF8531_4

Product data sheet

Rev. 04 — 13 June 2008

5 of 44

NXP Semiconductors

PCF8531

34 x 128 pixel matrix driver

[1]

Fab 1 identiﬁcation starts with nnnnnn, where n represents a number between 0 and 9.

[2]

Fab 2 identiﬁcation starts with AXnnnn, where X represents a letter and n represents a number between 0

and 9.

6.2 Pin description

Fig 4.

Chip dimensions

Table 4.

Bonding pad dimensions

Pad

Size

Unit

Pad pitch

µm

Bump dimensions

× 90 × 17.5 (±3)

µm

Wafer thickness (excluding bumps)

381

µm

Die size L

× W

Fab 1[1]

12.23

× 1.96

Fab 2[2]

12.14

× 1.86

001aag908

pitch

PCF8531

Table 5.

Bonding pad description

All x/y coordinates represent the position of the center of each pad with respect to the center

(x/y = 0) of the chip (see Figure 2).

Symbol

Pad

X (

µm)

Y (

µm)

Description

5973.6

−821.7

dummy

5969.5

823.4

5899.5

823.4

5829.5

823.4

5479.5

823.4

5409.5

823.4

5059.5

823.4

4989.5

823.4

4639.5

823.4

4569.5

823.4

4219.5

823.4

4149.5

823.4

3799.5

823.4

3729.5

823.4

OSC

3449.5

823.4

oscillator input

[1]

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