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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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PCF2113AU/10/F4 датащи(PDF) 61 Page - NXP Semiconductors |
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PCF2113AU/10/F4 датащи(HTML) 61 Page - NXP Semiconductors |
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61 / 65 page  PCF2113_FAM_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 4 March 2008 61 of 65 NXP Semiconductors PCF2113x LCD controllers/drivers Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 42. For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. Table 30. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature ( °C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 MSL: Moisture Sensitivity Level Fig 42. Temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature |
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