PCA9554 datasheet(2/30 Pages) NXP

2 / 30 page

PCA9554_9554A_7

Product data sheet

Rev. 07 — 13 November 2006

2 of 30

NXP Semiconductors

PCA9554/PCA9554A

8-bit I2C-bus and SMBus I/O port with interrupt

I ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per

JESD22-A115 and 1000 V CDM per JESD22-C101

I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA

I Packages offered: DIP16, SO16, SSOP16, SSOP20, TSSOP16,

HVQFN16 (2 versions: 4

× 4 × 0.85 mm and 3 × 3 × 0.85 mm), and bare die

Ordering information

Table 1.

Ordering information

Tamb = −40 °C to +85 °C.

Type number

Topside mark

Package

Name

Description

Version

PCA9554N

DIP16

plastic dual in-line package; 16 leads (300 mil);

long body

SOT38-1

PCA9554AN

PCA9554D

SO16

plastic small outline package; 16 leads;

body width 7.5 mm

SOT162-1

PCA9554AD

PCA9554DB

9554DB

SSOP16

plastic shrink small outline package; 16 leads;

body width 5.3 mm

SOT338-1

PCA9554ADB

9554A

PCA9554TS

PCA9554

SSOP20

plastic shrink small outline package; 20 leads;

body width 4.4 mm

SOT266-1

PCA9554ATS

PA9554A

PCA9554PW

9554DH

TSSOP16

plastic thin shrink small outline package; 16 leads;

body width 4.4 mm

SOT403-1

PCA9554APW

9554ADH

PCA9554BS

9554

HVQFN16

plastic thermal enhanced very thin quad ﬂat package;

no leads; 16 terminals; body 4

× 4 × 0.85 mm

SOT629-1

PCA9554ABS

554A

PCA9554BS3

P54

HVQFN16

plastic thermal enhanced very thin quad ﬂat package;

no leads; 16 terminals; body 3

× 3 × 0.85 mm

SOT758-1

PCA9554ABS3

54A

PCA9554U

bare die

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