PCA9532_4

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 04 — 17 March 2009

4 of 29

NXP Semiconductors

PCA9532

5.2 Pin description

[1]

be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board

level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad

on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the

PCB in the thermal pad region.

Table 2.

Pin description

Symbol

Pin

Description

SO24,

TSSOP24

HVQFN24

A0

1

22

address input 0

A1

2

23

address input 1

A2

3

24

address input 2

LED0

4

1

LED driver 0

LED1

5

2

LED driver 1

LED2

6

3

LED driver 2

LED3

7

4

LED driver 3

LED4

8

5

LED driver 4

LED5

9

6

LED driver 5

LED6

10

7

LED driver 6

LED7

11

8

LED driver 7

12

9[1]

supply ground

LED8

13

10

LED driver 8

LED9

14

11

LED driver 9

LED10

15

12

LED driver 10

LED11

16

13

LED driver 11

LED12

17

14

LED driver 12

LED13

18

15

LED driver 13

LED14

19

16

LED driver 14

LED15

20

17

LED driver 15

RESET

21

18

reset input (active LOW)

SCL

22

19

serial clock line

SDA

23

20

serial data line

24

21

supply voltage