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PBLS2002D датащи(PDF) 4 Page - NXP Semiconductors |
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PBLS2002D датащи(HTML) 4 Page - NXP Semiconductors |
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4 / 16 page ![]() PBLS2002D_2 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 — 27 August 2009 4 of 16 NXP Semiconductors PBLS2002D 20 V PNP BISS loadswitch 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1cm2. [3] Device mounted on a ceramic PCB, Al2O3, standard footprint. Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Per device Rth(j-a) thermal resistance from junction to ambient in free air [1] - - 315 K/W [2] - - 236 K/W [3] - - 210 K/W FR4 PCB, standard footprint Fig 2. TR1 (PNP): Transient thermal impedance from junction to ambient as a function of pulse time; typical values 0 006aaa415 10 1 102 103 Zth(j-a) (K/W) 10−1 10−5 10 10−2 10−4 102 10−1 tp (s) 10−3 103 1 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 |
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