GTL2003_1

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 01 — 27 July 2007

13 of 19

NXP Semiconductors

GTL2003

8-bit bidirectional low voltage translator

14. Package outline

Fig 11. Package outline SOT360-1 (TSSOP20)

UNIT

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

6.6

6.4

4.5

4.3

0.65

6.6

6.2

0.4

0.3

0.5

0.2

8

0

o

o

0.13

0.1

0.2

1

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT360-1

MO-153

99-12-27

03-02-19

D

Z

e

0.25

110

20

11

pin 1 index

θ

A

Q

detail X

L

(A )

3

E

c

X

A

y

0

2.5

5 mm

scale

TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm

SOT360-1

A

max.

1.1