LTC2757

19

2757f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

LX Package

48-Lead Plastic LQFP (7mm

× 7mm)

(Reference LTC DWG # 05-08-1760 Rev Ø)

LX48 LQFP 0907 REVØ

0

° – 7°

11

° – 13°

0.45 – 0.75

1.00 REF

11

° – 13°

9.00 BSC

AA

7.00 BSC

1

2

7.00 BSC

9.00 BSC

48

1.60

MAX

1.35 – 1.45

0.05 – 0.15

0.09 – 0.20

0.50

BSC

0.17 – 0.27

GAUGE PLANE

0.25

NOTE:

1. PACKAGE DIMENSIONS CONFORM TO JEDEC #MS-026 PACKAGE OUTLINE

2. DIMENSIONS ARE IN MILLIMETERS

3. DIMENSIONS OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.25mm ON ANY SIDE, IF PRESENT

4. PIN-1 INDENTIFIER IS A MOLDED INDENTATION, 0.50mm DIAMETER

5. DRAWING IS NOT TO SCALE

SEE NOTE: 4

C0.30 – 0.50

R0.08 – 0.20

7.15 – 7.25

5.50 REF

1

2

5.50 REF

7.15 – 7.25

48

PACKAGE OUTLINE

RECOMMENDED SOLDER PAD LAYOUT

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

SECTION A – A

0.50 BSC

0.20 – 0.30

1.30 MIN