NXP Semiconductors

Product specification

HF power MOS transistor

BLF145

PACKAGE OUTLINE

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

99-03-29

IEC

JEDEC

EIAJ

SOT123A

0

5

10 mm

scale

Flanged ceramic package; 2 mounting holes; 4 leads

SOT123A

1

2

43

U3

U2

H

H

b

Q

D

D1

U1

q

A

F

c

p

B

C

A

M

A

M

B

α

UNIT

A

mm

D

b

5.82

5.56

0.18

0.10

9.73

9.47

9.78

9.42

20.71

19.93

3.33

3.04

6.48

6.22

7.47

6.37

c

D1

U2

U3

9.78

9.39

0.51

0.25

w2

w1

45

°

α

U1

24.87

24.64

Q

4.63

4.11

q

18.42

F

2.72

2.31

inches

0.229

0.219

0.007

0.004

0.383

0.373

0.385

0.371

0.815

0.785

0.131

0.120

0.255

0.245

0.294

0.251

0.385

0.370

0.020

0.010

0.980

0.970

0.182

0.162

0.725

0.107

0.091

p

H

DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

w2

C

M

M

Rev. 04 - 5 January 2007

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