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BAW101S датащи(PDF) 4 Page - NXP Semiconductors |
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BAW101S датащи(HTML) 4 Page - NXP Semiconductors |
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4 / 9 page ![]() 2003 May 13 4 NXP Semiconductors Product data sheet High voltage double diode BAW101S THERMAL CHARACTERISTICS Notes 1. One or more diodes loaded. 2. Device mounted on an FR4 printed-circuit board, cathode-lead mounting pad = 1 cm2. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-s thermal resistance from junction to soldering point note 1 255 K/W Rth j-a thermal resistance from junction to ambient note 2 357 K/W GRAPHICAL DATA handbook, halfpage 0 (1) (2) 50 100 Tamb (°C) IF (mA) 200 300 0 100 200 150 MLE057 Device mounted on an FR4 printed-circuit board. Cathode-lead mounting pad = 1 cm2. Fig.2 Maximum permissible continuous forward current as a function of ambient temperature. (1) Single diode loaded. (2) Double diode loaded. handbook, halfpage 02 600 IF (mA) 0 200 400 MBG384 1 VF (V) (1) (3) (2) (1) Tj = 150 °C; typical values. (2) Tj = 25 °C; typical values. (3) Tj = 25 °C; maximum values. Fig.3 Forward current as a function of forward voltage. |
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