SSM9928 datasheet(2/6 Pages) SSC

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SSM9928(G)EO

Rev.2.01 12/06/2004

Electrical Characteristics @ Tj=25

oC (unless otherwise specified)

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

BVDSS

Drain-Source Breakdown Voltage

VGS=0V, ID=250uA

∆BV

DSS/

∆T

Breakdown Voltage Temperature Coefficient

Reference to 25°C, ID=1mA

0.02

V/°C

RDS(ON)

Static Drain-Source On-Resistance

VGS=4.5V, ID=5A

Ω

VGS=2.5V, ID=2A

Ω

VGS(th)

Gate Threshold Voltage

VDS=VGS, ID=250uA

0.5

gfs

Forward Transconductance

VDS=10V, ID=5A

IDSS

Drain-Source Leakage Current (Tj=25

oC)

VDS=20V, VGS=0V

Drain-Source Leakage Current (Tj=70

oC)

VDS=20V ,VGS=0V

IGSS

Gate-Source Leakage

VGS=±12V

±10

Total Gate Charge

ID=5A

15.9

Qgs

Gate-Source Charge

VDS=10V

1.5

Qgd

Gate-Drain ("Miller") Charge

VGS=4.5V

7.4

td(on)

Turn-on Delay Time

VDS=10V

6.2

Rise Time

ID=1A

td(off)

Turn-off Delay Time

RG=3.3Ω ,VGS=4.5V

Fall Time

RD=10Ω

-11

Ciss

Input Capacitance

VGS=0V

530

Coss

Output Capacitance

VDS=20V

245

Crss

Reverse Transfer Capacitance

f=1.0MHz

125

Source-Drain Diode

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

Continuous Source Current ( Body Diode )

VD=VG=0V,VS=1.2V

0.83

VSD

Forward On Voltage

Tj=25°C,IS=5A,VGS=0V

1.2

Notes:

1.Pulse width limited by Max. junction temperature.

2.Pulse width <300us , duty cycle <2%.

3.Surface mounted on 1 in

2 copper pad of FR4 board ; 208°C/W when mounted on Min. copper pad.

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