VRF157FL

PIN 1 - DRAIN

PIN 2 - SOURCE

PIN 3 - SOURCE

PIN 4 - GATE

1.000

.500

.150r

.500

.466

.750

1.500

1.250

.300

.200

.250

.250

.005 .040

.125d

1

2

4

3

D

S

G

D2

R10

R1

C3

R12

C7

D.U.T.

22p F

T1

C9

L1

L2

C14

R14

R15

C8

D.U.T.

C13

50V

OUTPUT

R14

+

-

C10

C11

C12

T2

BIAS 36-50V

-

+

R4

R5

R2

R6

R11

R13

D3

C1

R7

R3

D1

C2

R8

C4

R9

3

2

4

5

6

7

13

11

12

10

C1 - 1000pF Ceramic

C2, C3, C4 -0.1μF Ceramic Disc Capacitor

C5 - 0.01μF Ceramic Chip Capacitor

C6, C12 - 0.1μF Ceramic Chip Capacitor

C7, C8 - Two 2200 pF Ceramic Chip Capacitors in

Parallel

C9 - 820pF Ceramic Chip Capacitor

C10, C1 1 - 1000pF Ceramic Chip Capacitor

C13 - 0.47μF Ceramic Chip Capacitor or Two Smaller

Values in Parallel

C14 - Unencapsulated Mica, 500V Two 1000pF Units

in Series, Mounted Under T2

D1 - IN5357A or Equivalent

D2, D3 - IN4148 or Equivalent

C1 - MC1723 (723) Voltage Regulator

L1, L2 - 15 ηH Connecting Wires to R14 and R15,

2.5cm Each #20 AWG

L3 - 10μH, 10 Turns #12 AWG Enameled Wire on

Fair-Rite Products Corp. Ferrite Toroid

#5961000401 or Equivalent

R1, R2 - 1.0K Single Turn Trimpots

R3 - 10K Single Turn Trimpot

R4 - 470 Ohms, 2.0 Watts

R5 - 10 Ohms

R6, R12, R13 - 2.0K Ohms

R7 - 10K Ohms

R8 - Exact Value Depends on Thermistor R9 used

(Typically 5.0 - 10K)

R9 - Thermistor, Keystone RL1009-5820-97-D1 or

Equivalent

R10, R11 - 100 Ohms, 1.0W Carbon

R14, R15 - EMC Technology Model 5308 or KDI

Pyrofilm PPR 970-150-3 Power

Resistors, 25 Ohms

T1, T2 - 9:1 and 1:9 Impedance Ratio RF

Transformers

Unless otherwise noted, all resistors are 1/2 watt metal film type. All chip capacitors except C13 are ATC type 100/200B or Dielectric Laboratories type C17.

Microsemi’s products are covered by one or more of U.S. patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583

4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743, 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262

and foreign patents. US and Foreign patents pending. All Rights Reserved.

Figure 9. 2-50MHz

1kW Wideband Amplifier

HAZARDOUS MATERIAL WARNING

The ceramic portion of the device between leads and

mounting flange is beryllium oxide. Beryllium oxide dust

is highly toxic when inhaled. Care must be taken during

handling and mounting to avoid damage to this area.

These devices must never be thrown away with general

industrial or domestic waste.

Thermal

Considerations

and

Package

Mounting:

The rated 1350W power dissipation is only available

when the package mounting surface is at 25°C and

the junction temperature is 200°C. The thermal resis-

tance between junctions and case mounting surface

is 0.13°C/W. When installed, an additional thermal

impedance of 0.09°C/W between the package base

and the mounting surface is smooth and flat. Thermal

joint compound must be used to reduce the effects of

small surface irregularities. The heatsink should incor-

porate a copper heat spreader to obtain best results.

The lid maintains the required mounting pressure while

allowing for thermal expansion of both the device and

the heat sink. Four 6-32 (M3.5) screws provide the

minimum 125 lb. required mounting force. T=4-6 in-lb.

Please refer to App Note 1802 "Mounting Instructions

for Flangeless Packages."