SG1844/SG1845 Series

PRODUCT DA T ABOOK 1996/1997

Copyright © 2000

Rev. 1.6c

2

ABSOLUTE MAXIMUM RATINGS

(Notes 1 & 2)

Supply Voltage (I

Supply Voltage (Low Impedance Source) ........................................................ 30V

Output Current (Peak) ....................................................................................... ±1A

Output Current (Continuous) ....................................................................... 350mA

Output Energy (Capacitive Load) ....................................................................... 5µJ

Error Amp Output Sink Current ..................................................................... 10mA

Operating Junction Temperature

Hermetic (J, Y, F, L Packages) ................................................................... 150°C

Plastic (N, M, D, DM Packages) ................................................................ 150°C

Storage Temperature Range .......................................................... -65°C to +150°C

Lead Temperature (Soldering, 10 Seconds) .................................................. 300°C

PACKAGE PIN OUTS

V

REF

V

CC

OUT UT

GND

COM

V

FB

I

SENSE

R

1

8

27

36

45

M & Y PACKAGE

(Top View)

DM PACKAGE

(Top View)

V

REF

V

CC

OUT UT

GND

COM

V

FB

I

SENSE

R

1

8

27

36

45

V

REF

N.C.

V

CC

V

C

OUT UT

GND

WR GND

COM

N.C.

V

FB

N.C.

I

SENSE

N.C.

R

1

14

213

312

411

510

69

78

D PACKAGE

(Top View)

M PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

95°C/W

N PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

65°C/W

DM PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

165°C/W

D PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

120°C/W

Y PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

130°C/W

J PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

80°C/W

F PACKAGE:

THERMAL RESISTANCE-JUNCTION TO CASE,

θθθθθ

JC

80°C/W

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

145°C/W

L PACKAGE:

THERMAL RESISTANCE-JUNCTION TO CASE,

θθθθθ

JC

35°C/W

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

120°C/W

Junction Temperature Calculation: T

The

θ

system. All of the above assume no ambient airflow.

THERMAL DATA

Note 1. Exceeding these ratings could cause damage to the device.

Note 2. All voltages are with respect to Pin 5. All currents are positive into the specified

terminal.

1

14

213

312

411

510

69

78

J & N PACKAGE

(Top View)

COM

N.C.

V

FB

N.C.

I

SENSE

N.C.

R

V

REF

N.C.

V

CC

V

C

OUT UT

GROUND

OWER GND

F PACKAGE

(Top View)

10.V

REF

9. V

CC

8. V

C

7. OUT UT

6. GND

1. COM

2. V

FB

3. I

SENSE

4. R

5. OWER GND

1

10

29

38

47

56

L PACKAGE

(Top View)

32

4

5

6

7

8

911

10

1. N.C.

2. N.C.

3. COM .

4. N.C.

5. V

FB

6. N.C.

7. I

SENSE

8. R

9. N.C.

10. N.C.

120 19

18

17

16

15

14

12 13

11. N.C.

12. WR GND

13. GND

14. N.C.

15. OUT UT

16. N.C.

17. V

C

18. V

CC

19. N.C.

20. V

REF

RoHS / Pb-free Peak Package Solder Reflow Temp. (40 second max. exposure)............................... 260°C (+0, -5)

RoHS / Pb-free 100% Matte Tin Lead Finish

RoHS / Pb-free 100% Matte Tin Lead Finish

M Package: RoHS / Pb-free 100% Matte Tin Lead Finish

N Package: RoHS / Pb-free 100% Matte Tin Lead Finish