GC9001 – GC9011

Microsemi

Microwave Products

75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748

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TM

®

Copyright

 2007

Rev: 2009-01-19

RoHS Compliant

PASSIVE DEVICES – Spiral Bias Elements

D E SCRI PTI ON

The GC9000 series of spiral bias element chips are photolithographically

fabricated planar spiral conductors supported on a high quality fused quartz

substrate. These devices are designed to meet hybrid microwave circuit

requirements for DC power injection through Ku (or J) band. The actual spiral

bias element, consists of a 5 micron, nominal, thick plated gold spiral trace

with a 3 mil diameter bonding pad at either end.

A dense passivation is applied on the conductive portion of the spiral

geometry so that undesirable environmental or particulate effects during

operation can be prevented. The bonding pads are left exposed to provide

easy, low resistance lead attachment.

and provide durability during handling and assembly.

Contemporary fabrication processes combined with Microsemi Lowell’s

extensive experience in microwave component and hybrid circuit engineering

has generated a product that will be both operationally predictable and

reliable when used as a means to supply DC to a small signal hybrid

microwave circuit.

This series of devices meets RoHS requirements per EU Directive

2002/95/EC. The standard terminal finish is gold unless otherwise specified.

Consult the factory if you have special requirements.

APPLICATIONS

Bias injection into oscillators, amplifiers and microwave switches

(bias tees). Can be used to bias tuning varactor diodes, pin diodes,

transistors and monolithic circuit components. These spiral elements

provide extreme freedom from in band resonance; very smooth wide

frequency response.

ABSOLUTE MAXIMUM RATINGS AT 25º C

(UNLESS OTHERWISE SPECIFIED)

Rating

Symbol

Value

Unit

Working Current

I

250

mA

Storage Temperature

-65 to +200

ºC

Operating Temperature

-55 to +150

ºC

Specifications are subject to change, consult factory for the latest information.

These devices are ESD sensitive and must be handled using ESD precautions.

terminations suitable for wire-bonding.

KEY FEATURES

 Dimensional Uniformity

 Planar Design

 Passivated Spiral Element

 Physical and Dimensional Stability

Through Temp Cycle and Vibration

 Models as a Lossy Transmission

Line

 Eliminates Potting or Coating Wire-

wound Coils

 Designed for Microwave

Applications From 2 to 18 GHz

 Reduced Assembly Costs

 RoHS Compliant

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APPLICATIONS/BENEFITS

 RF Bias Networks

 Wideband performance