HT95R55 datasheet(4/80 Pages) HOLTEK

4 / 80 page

Pad Name

I/O

Options

Description

VREF

Reference voltage output, normally VDD/2 for DTMF receiver.

TIP

Input pin connected to the tip side of the twisted pair wires for FSK decoder. It

is internally biased to 1/2 VDD when the device is in power-up mode. This pin

must be DC isolated from the line.

RING

Input pin connected to the ring side of the twisted pair wires for FSK decoder.

It is internally biased to 1/2 VDD when the device is in power-up mode. This

pin must be DC isolated from the line.

RDET, LBIN

This pin detects ring energy on the line through an attenuating network for

FSK decoder.

RTIMEB

Schmitt trigger input and NMOS output pin which functions with RDET1 pin to

make an RC network that performs ring detection function for FSK decoder.

X1 and X2 are connected to an external 32768Hz crystal or resonator for the

system clock.

¾¾

External low pass filter pin used for the frequency up conversion circuit.

RES

Schmitt trigger reset input. Active low.

VDD

¾¾

Positive power supply

VSS

¾¾

Negative power supply, ground.

VDD2

¾¾

DTMF receiver positive power supply

VSS2

¾¾

DTMF receiver negative power supply

VDD3

¾¾

Positive power supply for FSK Decoder

VSS3

¾¾

Negative power supply for FSK Decoder

Note:

Each pin on PA can be programmed through a configuration option to have a wake-up function.

Absolute Maximum Ratings

Supply Voltage ...........................VSS

-0.3V to VSS+6.0V

Storage Temperature ............................

-50°Cto125°C

Input Voltage..............................VSS

-0.3V to VDD+0.3V

Operating Temperature...........................

-40°Cto85°C

IOL Total ..............................................................150mA

IOH Total............................................................

-100mA

Total Power Dissipation .....................................500mW

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed

in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.

HT95R54/HT95R55

Rev. 1.00

March 3, 2010

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