TL(BF,EGF)1100C(T11)

2010-01-26

7

Cleaning

When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.

It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the

recommended conditions). In selecting the one for your actual usage, please perform sufficient review

on washing condition, using condition and etc.

ASAHI CLEAN AK-225AES

: (made by ASAHI GLASS)

KAO CLEAN THROUGH 750H

: (made by KAO)

PINE ALPHA ST-100S

: (made by ARAKAWA CHEMICAL)

Precautions when Mounting

Do not apply force to the plastic part of the LED under high-temperature conditions.

To avoid damaging the LED plastic, do not apply friction using a hard material.

When installing the PCB in a product, ensure that the device does not come into contact with other cmponents.

Tape Specifications

1. Product number format

The type of package used for shipment is denoted by a symbol suffix after the product number. The

method of classification is as below. (this method, however does not apply to products whose electrical

characteristics differ from standard Toshiba specifications)

(1)

Tape Type: T11 (4-mm pitch)

(2)

Example

2.

Tape dimensions

Unit: mm

Symbol

Dimension

Tolerance

Symbol

Dimension

Tolerance

D

1.5

+0.1/−0

2.0

±0.05

E

1.75

±0.1

W

8.0

±0.3

4.0

±0.1

P

4.0

±0.1

t

0.3

±0.05

2.9

±0.1

F

3.5

±0.05

3.7

±0.1

1.5

±0.1

2.3

±0.1

TLBF1100C (T11)

Tape type

Toshiba product No.

P

F

E

Polarity

t

D