Data Sheet AS2533-36

Pin Configuration

Packaging

28 Pin SOIC (suffix T)

The device is available in the packages outlined below (not

to scale). For exact mechanical package dimensions

28-pin plastic SOIC (suffix T)

Max. Body Length

18.1mm / 713mil

Max. Body Width

7.6mm / 300mil

Pitch

1.27mm / 50mil

Ordering Information

Device

Order Number

Package

Features

AS2533 T

AS2533U-ZSO-U

28 pin SOIC in tubes

LNR, 4 direct/10 indirect memories

AS2533 F

pls see bottom rows

Dice on foil, sawn

LNR, 4 direct/10 indirect memories

AS2533 W

pls see bottom rows

Dice on wafer

LNR, 4 direct/10 indirect memories

AS2534B T

AS2534U-ZSO-U

28 pin SOIC in tubes

AS2534B F

pls see bottom rows

Dice on Foil, sawn

LNR only, no direct/indirect memories

AS2534B W

pls see bottom rows

Dice on Wafer

LNR only, no direct/indirect memories

AS2534R T

AS2534R-ZSO-U

28 pin SOIC in tubes

AS2534R F

pls see bottom rows

Dice on Foil, sawn

LNR only, no direct/indirect memories, ringer fixed

AS2534R W

pls see bottom rows

Dice on Wafer

LNR only, no direct/indirect memories, ringer fixed

AS2535 T

AS2535U-ZSO-U

28 pin SOIC

LNR, 12 direct memories

AS2535 F

pls see bottom rows

Dice on Foil, sawn

LNR, 12 direct

AS2535 W

pls see bottom rows

Dice on Wafer

LNR, 12 direct

AS2536 T

AS2535U-ZSO-U

28 pin SOIC

LNR, 4 direct/10 indirect memories

AS2536 F

pls see bottom rows

Dice on Foil, sawn

LNR, 4 direct/10 indirect memories

AS2536 W

pls see bottom rows

Dice on Wafer

LNR, 4 direct/10 indirect memories

AS253x F

AS253xU-ZSW-F

Dice on Foil, sawn

AS253x W

AS253xU-ZSW

Dice on Wafer

AS253xR F

AS253xR-ZSW-F

Dice on Foil, sawn

AS253xR W

AS253xR-ZSW

Dice on Wafer

Please Note:

(1)

For wafer delivery or dice-on-foil delivery, the versions can be selected by bond options.

(2)

For deliveries as packaged devices (SOIC28), LNR only is tested, direct and indirect memories are not tested!

Revision 8.8

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