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AS1369

Data Sheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-

istics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

(EQ 1)

Where:

The value of

Note: Exceeding the maximum allowable dissipation will cause excessive device temperature and the

regulator will go into thermal shutdown.

The AS1369 uses an internal protective structure against light influence. However, exposing the WLP package to

direct light could cause device malfunction.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

Input Supply Voltage

-0.3

+7

V

Shutdown Input Voltage

-0.3

+7

V

Output Voltage

-0.3

+7

V

Short-circuit protected.

Input/Output Voltage

1

-0.3

+7

V

Power Dissipation

2

junction-to-ambient thermal resistance (

power dissipation at any ambient temperature is calculated as:

360

mW

Internally limited. Mounted on PCB.

Operating Junction Temperature

-40

+125

ºC

Storage Temperature Range

-65

+150

ºC

ESD

2kV

HBM MIL-Std. 883E 3015.7 methods

500

V

CDM JESD22-C101C methods

Latch-Up

-100

+100

mA

JEDEC 78

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020C “Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid State

Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).