CC1190

SWRS089 A – NOVEMBER 2009 – REVISED FEBRUARY 2010

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

DEVICE

TEMPERATURE

TRANSPORTION MEDIA

CC1190RGVR

Tape and Reel, 2500

-40°C to 85°C

QFN (RVG) 16

CC1190RGVT

Tape and Reel, 250

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

ABSOLUTE MAXIMUM RATINGS

Under no circumstances must the absolute maximum ratings be violated. Stress exceeding one or more of the limiting values

may cause permanent damage to the device.

VALUE

UNIT

All supply pins must have the same voltage

–0.3 to 3.8

V

Voltage on any digital pin

–0.3 to VDD + 0.3, max 3.8

V

Input RF level

10

dBm

Storage temperature range

–50 to 150

°C

Human-body model, non RF pins

2000

V

Human-body model, RF pins: PA_IN, PA_OUT, TR_SW,

ESD

1500

V

LNA_IN, LNA_OUT

Charged device model

1000

V

RECOMMENDED OPERATING CONDITIONS

MIN

MAX

UNIT

Ambient temperature range

–40

85

°C

Operating supply voltage

2

3.7

V

Operating frequency range

850

950

MHz

ELECTRICAL CHARACTERISTICS

matching components optimized for 915 MHz operation.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

3

mA

Receive current

26

µA

302

Transmit current

No input signal, HGM = 1

56

mA

No input signal, HGM = 0

29

Power down current

LNA_EN = PA_EN = 0

50

200

nA

High input level (control pins)

HGM, LNA_EN, PA_EN

1.3

VDD

V

Low input level (control pins)

HGM, LNA_EN, PA_EN

0.3

V

Power down

→ Receive mode, switching

300

ns

time

Power down

→ Transmit mode, switching

600

ns

time

2

Submit Documentation Feedback

Copyright © 2009–2010, Texas Instruments Incorporated

Product Folder Link(s) :CC1190