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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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SE97TP датащи(PDF) 45 Page - NXP Semiconductors |
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SE97TP датащи(HTML) 45 Page - NXP Semiconductors |
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45 / 55 page  SE97_7 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 07 — 29 January 2010 45 of 55 NXP Semiconductors SE97 DDR memory module temp sensor with integrated SPD, 3.3 V 12. Package outline Fig 41. Package outline SOT530-1 (TSSOP8) UNIT A1 A max. A2 A3 bp L HE Lp wy v ce D(1) E(2) Z(1) θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.85 0.30 0.19 0.20 0.13 3.1 2.9 4.5 4.3 0.65 6.5 6.3 0.70 0.35 8 ° 0 ° 0.1 0.1 0.1 0.94 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.7 0.5 SOT530-1 MO-153 00-02-24 03-02-18 w M bp D Z e 0.25 14 8 5 θ A A2 A1 Lp (A3) detail X L HE E c v M A X A y 2.5 5 mm 0 scale TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm SOT530-1 1.1 pin 1 index |
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