Temp.：50±2℃

Humidity test

appearance.

R.H.：90~95 %

Time.：96±2 hours

+125

for 30 minutes.

℃

-40

for 30 minutes.

℃

Time.：48±2 hours

Temp.：125±2℃

Time.：48±2 hours

Total：10 cycles

Temp.：-40±2℃

1.Temp：85±2℃

1.Temp：40±2℃

2.R.H.：90-95%

2.Time：1000±12 hours

3.Time：1000±12 hours

4. Load：Allowed DC current

3.Load：Allowed DC current

AR-001A

Humidity load life

more than ±5%

more than±10%

3.Q shall not change

2.Inductance shall not change

shorted or open winding.

Inductors shall not have a

Note： Inductors are to be tested after 1 hour at room temperature.

High temperature

storage

load life

High tempera - ture

test

storage

Thermal shock test

Low temperature

ABC'S DWG NO.

ABC'S ITEM NO.

attachment.

SPECIFICATION FOR APPROVAL

force indicated at left without a failure

device must withstand the minimum

the side of the component . The

copper substrate. A dynometer

force gauge shall be applied to

(230±5

for 10 seconds) to a tinned

℃

The device shall be reflow soldered

of the termination to board

-40 ~125

℃℃

PROD.

10N：1608

5N：1005

20N：2012，2520，3225

deformation or change in

1.There shall be no case

WOUND CHIP INDUCTOR

Temperature

characteristic

adhesion

(Push test)

Component

NAME

REF :

SW2520□□□□2□-□□□

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