Pad Assignment

Chip size: 118

´ 128 (mil)

2

* The IC substrate should be connected to VDD in the PCB layout artwork.

HT1625

Rev. 1.40

3

June 12, 2009

PATENTED

1

4 5

2

4 6

3

4 7

4

4 8

5

4 9

6

5 0

7

5 1

8

5 2

9

5 3

1 0

5 4

1 1

5 5

1 2

5 6

1 3

5 7

1 4

5 8

1 5

5 9

1 6

6 0

1 7

6 1

1 8

6 2

1 9

6 3

2 0

6 4

2 1

6 5

2 2

6 6

2 3

6 7

2 4

6 8

2 5

6 9

2 6

7 0

2 7

7 1

2 8

7 2

2 9

7 3

3 0

7 4

3 1

7 5

3 2

7 6

3 3

7 7

3 4

7 8

3 5

7 9

3 6

8 0

3 7

8 1

3 8

8 2

3 9

8 3

4 0

8 4

4 1

8 5

4 2

8 6

4 3

8 7

4 4

( 0 , 0 )

D A T A

V S S

O S C O

O S C I

V D D

V L C D

B Z

T 1

T 2

T 3

C O M 0

C O M 1

C O M 2

C O M 3

C O M 4

S E G 2 0

S E G 2 1

S E G 2 2

S E G 2 3

S E G 2 5

S E G 2 4

S E G 2 6

S E G 2 7

S E G 2 8

S E G 2 9

S E G 3 0

S E G 3 1

S E G 3 2

S E G 3 3

S E G 3 4

S E G 3 5

S E G 3 6

S E G 3 7

S E G 3 8

S E G 3 9

S E G 4 0

S E G 4 1

S E G 4 2

R D

W R

I R Q

B Z