SAW FILTER

HD F4552

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Page 9 of 13

40±2℃ with relative humidity of 90% to 96%

for 96

±4h. Then it shall be subjected to standard

atmospheric conditions for 1h, after which

measurement shall be made within 1h.

Thermal

shock

The specimen shall be subjected to 8 continuous

cycles each as shown below. Then it shall be

subjected to standard atmospheric conditions for

1h, after which measurement shall be made

within 1h.

Temperature

Duration

1

+25℃=>-40℃

0.5h

2

-40℃

4h

3

-40℃=>+85℃

2h

4

+85℃

4h

5

+85℃=>+25℃

0.5h

6

+25℃

1h

Resistance to

Soldering

heat

Reflow soldering method

Peak: 255 ±5 ℃, 220 ±5℃, 40s

At electrode temperature of the specimen.

The specimen shall be passed through the reflow

furnace with the condition shown in the above

profile for 1 time.

The specimen shall be stored at standard

atmospheric conditions for 1h, after which the

measurement shall be made. Test board shall be

1.6 mm thick. Base material shall be glass fabric

base epoxy resin.

be satisfied. There

shall

be

no

excessive change in

appearance.

Solder ability Immerse the pins melt solder at 260℃+5/-0℃

for 5 sec.

More then 95% of

total area of the

pins

should

be

covered with solder