Copyright

© ANPEC Electronics Corp.

Rev. A.4 - Sep., 2009

APL5930

www.anpec.com.tw

2

Ordering and Marking Information

Symbol

Parameter

Rating

Unit

VIN Supply Voltage (VIN to GND)

-0.3 ~ 4.0

V

VCNTL Supply Voltage (VCNTL to GND)

-0.3 ~ 7

V

VOUT to GND Voltage

V

POK to GND Voltage

-0.3 ~ 7

V

EN, FB to GND Voltage

V

Power Dissipation

3

W

Maximum Junction Temperature

150

Storage Temperature

-65 ~ 150

Maximum Lead Soldering Temperature, 10 Seconds

260

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Junction-to-Ambient Resistance in Free Air

(Note 2)

SOP-8P

42

θ

JC

Junction-to-Case Resistance in Free Air

(Note 3)

SOP-8P

18

Note 2:

θ

of SOP-8P is soldered directly on the PCB.

Note 3: The “Thermal Pad Temperature” is measured on the PCB copper area connected to the thermal pad of package.

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

1

2

3

4

8

7

6

5

VIN

Measured Point

PCB Copper

APL5930

Handling Code

Temperature Range

Package Code

Package Code

KA : SOP-8P

Operating Ambient Temperature Range

Handling Code

TR : Tape & Reel

Assembly Material

G : Halogen and Lead Free Device

Assembly Material

APL5930 KA :

APL5930

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