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AP2213 датащи(PDF) 18 Page - BCD Semiconductor Manufacturing Limited |
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AP2213 датащи(HTML) 18 Page - BCD Semiconductor Manufacturing Limited |
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18 / 22 page ![]() 500mA LOW NOISE LDO REGULATOR AP2213 Data Sheet 18 Nov. 2009 Rev. 1. 5 BCD Semiconductor Manufacturing Limited Input Capacitor A 1 µF minimum capacitor is recommended to be placed between VIN and GND. Output Capacitor It is required to prevent oscillation. 1 µF minimum is recommended when CBYP is unused. 2.2µF mini- mum is recommended when CBYP is 100pF. The out- put capacitor may be increased to improve transient response. Noise Bypass Capacitor Bypass capacitor is connected to the internal voltage reference. A 100pF capacitor connected from BYP to GND make this reference quiet, resulting in a significant reduction in output noise, but the ESR stable area will be narrowed. The start-up speed of the AP2213 is inversely proportional to the value of reference bypass capacitor. In some cases, if output noise is not a major concern and rapid turn-on is necessary, omit CBYP and leave BYP open. Power Dissipation Thermal shutdown may take place if exceeding the maximum power dissipation in application. Under all possible operating conditions, the junction tempera- ture must be within the range specified under abso- lute maximum ratings to avoid thermal shutdown. To determine if the power dissipated in the regulator reaches the maximum power dissipation (see figure 16, 17), using: TJ = PD*θJA + TA PD=(VIN-VOUT)*IOUT+VIN*IGND Where: TJ≤TJ(max), TJ(max) is absolute maximum rat- ings for the junction temperature; VIN*IGND can be ignored due to its small value. TJ(max) is 150oC, θJA is 90oC/W for TO-252-2 (1) package and 160oC/W for SOIC-8 package. Example: For 2.5V version packaged in SOIC-8, IOUT=500mA, TA=50oC, VIN(Max) is: (150oC-50oC)/(0.5A*160oC/W)+2.5V=3.75V Therefore, for good performance, please make sure that input voltage is less than 3.75V without heatsink when TA=50oC. Application Information |
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