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L9UG65063 датащи(PDF) 6 Page - LIGITEK electronics co., ltd. |
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L9UG65063 датащи(HTML) 6 Page - LIGITEK electronics co., ltd. |
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6 / 6 page ![]() 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Solderability Test This test intended to see soldering well performed or not. 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs Thermal Shock Test High Temperature High Humidity Test The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test Low Temperature Storage Test Operating Life Test The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. L9UG65063/L15-PF Reliability Test: Test Item PART NO. Test Condition Description MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference Standard Page 5/5 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only |
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