L9UG5233 datasheet(5/6 Pages) LIGITEK

5 / 6 page

The purpose of this is the resistance

of the device which is laid under

condition of low temperature for hours.

The purpose of this test is the resistance

of the device under tropical for hous.

The purpose of this is the resistance of

the device to sudden extreme changes

in high and low temperature.

This test intended to see soldering well

performed or not.

1.Ta=105

℃±5℃&-40℃±5℃

(10min) (10min)

2.total 10 cycles

1.T.Sol=230

℃±5℃

2.Dwell time=5

±1sec

1.T.Sol=260

℃±5℃

2.Dwell time= 10

±1sec.

Solder Resistance

Test

Solderability Test

Thermal Shock Test

High Temperature

High Humidity Test

1.Ta=65

℃±5℃

2.RH=90 %~95 %

3.t=240hrs

±2hrs

This test intended to determine the

thermal characteristic resistance

of the device to sudden exposures

at extreme changes in temperature

when soldering the lead wire.

MIL-STD-202: 210A

MIL-STD-750: 2031

JIS C 7021: A-1

MIL-STD-202: 208D

MIL-STD-750: 2026

MIL-STD-883: 2003

JIS C 7021: A-2

MIL-STD-202:103B

JIS C 7021: B-11

MIL-STD-202: 107D

MIL-STD-750: 1051

MIL-STD-883: 1011

Reliability Test:

PART NO. L9UG5233

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

The purpose of this is the resistance of

the device which is laid under ondition

of high temperature for hours.

This test is conducted for the purpose

of detemining the resisance of a part

in electrical and themal stressed.

Test Condition

1.Ta=-40

℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

1.Ta=105

℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

1.Under Room Temperature

2.If=20mA

3.t=1000 hrs (-24hrs, +72hrs)

High Temperature

Storage Test

Low Temperature

Storage Test

Operating Life Test

Test Item

Description

Page 4/4

MIL-STD-750: 1026

MIL-STD-883: 1005

JIS C 7021: B-1

JIS C 7021: B-12

MIL-STD-883:1008

JIS C 7021: B-10

Reference

Standard

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