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L9UG3831-PF датащи(PDF) 6 Page - LIGITEK electronics co., ltd.

номер детали L9UG3831-PF
подробное описание детали  SUPER BRIGHT ROUND TYPE LED LAMPS
PDF  6 Pages
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производитель  LIGITEK [LIGITEK electronics co., ltd.]
домашняя страница  http://www.ligitek.com
Logo LIGITEK - LIGITEK electronics co., ltd.

L9UG3831-PF датащи(HTML) 6 Page - LIGITEK electronics co., ltd.

  L9UG3831-PF Datasheet HTML 1Page - LIGITEK electronics co., ltd. L9UG3831-PF Datasheet HTML 2Page - LIGITEK electronics co., ltd. L9UG3831-PF Datasheet HTML 3Page - LIGITEK electronics co., ltd. L9UG3831-PF Datasheet HTML 4Page - LIGITEK electronics co., ltd. L9UG3831-PF Datasheet HTML 5Page - LIGITEK electronics co., ltd. L9UG3831-PF Datasheet HTML 6Page - LIGITEK electronics co., ltd.  
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LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Reference
Standard
JIS C 7021: B-12
Description
Reliability Test:
Test Item
Test Condition
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
The purpose of this is the resistance of
the device which is laid under ondition
of high temperature for hours.
High Temperature
Storage Test
Low Temperature
Storage Test
1.Ta=-40
℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
1.Ta=105
℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
Operating Life Test
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
MIL-STD-883:1008
JIS C 7021: B-10
Page 5/5
The purpose of this test is the resistance
of the device under tropical for hous.
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
High Temperature
High Humidity Test
Solder Resistance
Test
Thermal Shock Test
1.Ta=105
℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
1.Ta=65
℃±5℃
2.RH=90 %~95%
3.t=240hrs
±2hrs
This test intended to see soldering well
performed or not.
Solderability Test
1.T.Sol=230
℃±5℃
2.Dwell time=5
±1sec
1.T.Sol=260
℃±5℃
2.Dwell time= 10
±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202:103B
JIS C 7021: B-11
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
PART NO. L9UG3831-PF



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