L9UG3333 datasheet(5/5 Pages) LIGITEK

5 / 5 page

MIL-STD-202:103B

JIS C 7021: B-11

MIL-STD-202: 208D

MIL-STD-750: 2026

MIL-STD-883: 2003

JIS C 7021: A-2

MIL-STD-202: 210A

MIL-STD-750: 2031

JIS C 7021: A-1

MIL-STD-202: 107D

MIL-STD-750: 1051

MIL-STD-883: 1011

1.T.Sol=260

℃±5℃

2.Dwell time= 10

±1sec.

This test intended to determine the

thermal characteristic resistance

of the device to sudden exposures

at extreme changes in temperature

when soldering the lead wire.

Solderability Test

1.T.Sol=230

℃±5℃

2.Dwell time=5

±1sec

This test intended to see soldering well

performed or not.

1.Ta=105

℃±5℃&-40℃±5℃

(10min) (10min)

2.total 10 cycles

Solder Resistance

Test

Thermal Shock Test

High Temperature

High Humidity Test

1.Ta=65

℃±5℃

2.RH=90 %~95 %

3.t=240hrs

±2hrs

The purpose of this is the resistance of

the device to sudden extreme changes

in high and low temperature.

The purpose of this test is the resistance

of the device under tropical for hous.

PART NO. L9UG3333

Reliability Test:

Page 4/4

Reference

Standard

MIL-STD-750: 1026

MIL-STD-883: 1005

JIS C 7021: B-1

JIS C 7021: B-12

MIL-STD-883:1008

JIS C 7021: B-10

1.Under Room Temperature

2.If=20mA

3.t=1000 hrs (-24hrs, +72hrs)

This test is conducted for the purpose

of detemining the resisance of a part

in electrical and themal stressed.

Low Temperature

Storage Test

1.Ta=-40

℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

High Temperature

Storage Test

Operating Life Test

1.Ta=105

℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

The purpose of this is the resistance of

the device which is laid under ondition

of hogh temperature for hours.

The purpose of this is the resistance

of the device which is laid under

condition of low temperature for hours.

Test Item

Test Condition

Description

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