ICS853S024

LOW SKEW, 1-TO-24 DIFFERENTIAL-TO-3.3V, 2.5V LVPECL FANOUT BUFFER

PRELIMINARY

LOW SKEW LVPECL FANOUT BUFFER

10

ICS853S024AY REV. A APRIL 30, 2008

EPAD Thermal Release Path

In order to maximize both the removal of heat from the package

and the electrical performance, a land pattern must be

incorporated on the Printed Circuit Board (PCB) within the footprint

of the package corresponding to the exposed metal pad or

exposed heat slug on the package, as shown in Figure 5. The

solderable area on the PCB, as defined by the solder mask, should

be at least the same size/shape as the exposed pad/slug area on

the package to maximize the thermal/electrical performance.

Sufficient clearance should be designed on the PCB between the

outer edges of the land pattern and the inner edges of pad pattern

for the leads to avoid any shorts.

While the land pattern on the PCB provides a means of heat

transfer and electrical grounding from the package to the board

through a solder joint, thermal vias are necessary to effectively

conduct from the surface of the PCB to the ground plane(s). The

land pattern must be connected to ground through these vias. The

vias act as “heat pipes”. The number of vias (i.e. “heat pipes”) are

application specific and dependent upon the package power

dissipation as well as electrical conductivity requirements. Thus,

thermal and electrical analysis and/or testing are recommended to

determine the minimum number needed. Maximum thermal and

electrical performance is achieved when an array of vias is

incorporated in the land pattern. It is recommended to use as many

vias connected to ground as possible. It is also recommended that

the via diameter should be 12 to 13mils (0.30 to 0.33mm) with 1oz

copper via barrel plating. This is desirable to avoid any solder

wicking inside the via during the soldering process which may

result in voids in solder between the exposed pad/slug and the

thermal land. Precautions should be taken to eliminate any solder

voids between the exposed heat slug and the land pattern. Note:

These recommendations are to be used as a guideline only. For

further information, refer to the Application Note on the Surface

Mount Assembly of Amkor’s Thermally/Electrically Enhance

Leadfame Base Package, Amkor Technology.

Figure 5. Assembly for Exposed Pad Thermal Release Path - Side View (drawing not to scale)

GROUND PLANE

LAND PATTERN

SOLDER

THERMAL VIA

EXPOSED HEAT SLUG

(GROUND PAD)

PIN

PIN PAD

SOLDER

PIN

PIN PAD

SOLDER