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CPC7592MATR датащи(PDF) 18 Page - Clare, Inc. |
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CPC7592MATR датащи(HTML) 18 Page - Clare, Inc. |
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18 / 20 page ![]() CPC7592 18 www.clare.com R03 3.1.2 16-Pin DFN 3.2 Printed-Circuit Board Layout 3.2.1 16-Pin SOIC 3.2.2 16-Pin DFN NOTE: As the metallic pad on the bottom of the DFN package is connected to the substrate of the die, Clare recommends that no printed circuit board traces or vias be placed under this area to maintain minimum creepage and clearance values. EXPOSED METALLIC PAD 7.00 ± 0.25 (0.276 ± 0.01) 6.00 ± 0.25 (0.236 ± 0.01) INDEX AREA TOP VIEW SEATING PLANE SIDE VIEW 0.90 ± 0.10 (0.035 ± 0.004) 0.30 ± 0.05 (0.012 ± 0.002) 0.02, + 0.03, - 0.02 (0.0008, + 0.0012, - 0.0008) 0.20 (0.008) 4.25 ± 0.05 (0.167 ± 0.002) 0.55 ± 0.10 (0.022 ± 0.004) 6.00 ± 0.05 (0.236 ± 0.002) BOTTOM VIEW Dimensions mm (inch) Terminal Tip 0.80 (0.032) 16 1 2.00 (0.079) 1.27 (0.050) mm (inches) DIMENSIONS 9.40 (0.370) 0.60 (0.024) DIMENSIONS mm (inches) 5.80 (0.228) 0.35 (0.014) 1.05 (0.041) 0.80 (0.031) |
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