Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications

and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of

Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability,

fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other

applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental

damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-CPC2017N-R01

©Copyright 2009, Clare, Inc.

OptoMOS® is a registered trademark of Clare, Inc.

All rights reserved. Printed in USA.

9/10/09

For additional information please visit our website at: www.clare.com

5

CPC2017N

MECHANICAL DIMENSIONS

RoHS

2002/95/EC

Pb

MANUFACTURING INFORMATION

Moisture Sensitivity

Clare has characterized the moisture reflow sensitivity

of this package, and has determined that this

component must be handled in accordance with

IPC/JEDEC standard J-STD-033 moisture sensitivity

level (MSL), level 3 classification.

Soldering Reflow Profile

For proper assembly, the component must be

processed in accordance with the current revision

of IPC/JEDEC standard J-STD-020. Failure to

follow the recommended guidelines may cause

permanent damage to the device resulting in impaired

performance and/or a reduced lifetime expectancy.

Washing

Clare does not recommend ultrasonic cleaning or the

use of chlorinated solvents.

8-Lead SOIC Narrow Package

Recommended PCB Land Pattern

Dimensions

mm

(inches)

2.184 MAX

(0.086 MAX)

0.838 ± 0.102

(0.033 ± 0.004)

0.381 ± 0.051

(0.015 ± 0.002)

Lead to Package Standoff

MIN 0.0254 (0.001)

(MAX 0.102 (0.004)

0.432 ± 0.127

(0.017 ± 0.005)

0.203 ± 0.025

(0.008 ± 0.001)

1.016 ± 0.025

(0.040 ± 0.001)

5.60

(0.22)

1.30

(0.051)

0.55

(0.022)

2.54

(0.100)

9.347 ± 0.203

(0.368 ± 0.008)

6.096 ± 0.102

(0.240 ± 0.004)

3.810 ± 0.051

(0.150 ± 0.002)

2.540 TYP

(0.100 TYP)

Pin 1

K

(0.106)

K

(0.091)

6.8

(0.268)

2.0

(0.079)

B

(0.406)

A

(0.256)

2.0

(0.079)

3.0

(0.118)

R0.5

(0.020)

12.0

(0.472)

4.0

(0.157)

1.50

(0.059)

16.0

(0.63)

7.5

(0.295)

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

330.2 DIA.

(13.00 DIA.)