CPC1465

14

www.clare.com

R02

3.2 Printed Circuit Board Layout Pattern

3.2.1 SOIC

3.2.2 DFN

NOTE: As the metallic pad on the bottom of the DFN

package is connected to the substrate of the die, Clare

recommends that no printed circuit board traces or

vias be placed under this area.

3.3 Tape and Reel Packaging

3.3.1 SOIC

1.90

(0.075)

1.27

(0.050)

mm

(inches)

DIMENSIONS

9.30

(0.366)

0.60

(0.024)

DIMENSIONS

mm

(inches)

5.80

(0.228)

0.35

(0.014)

1.05

(0.041)

0.80

(0.031)

NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2

Dimensions

mm

(inches)

Embossment

Embossed

Carrier

330.2 Dia

(13.00 Dia)

Top Cover

Tape Thickness

0.102 Max

(0.004 Max)

User Direction of Feed

Top Cover

Tape

P=12.00

(0.47)

A

(0.429 + 0.010)

B

(0.421 + 0.01)

W=16.00 + 0.30

(0.630 + 0.010)

K

(0.193 + 0.01)

K

(0.106 + 0.01)

Pin 1