For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

11

11 - 16

Outline Drawing

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

[3]

HMC698LP5

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

H698

XXXX

HMC698LP5(E)

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

H698

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS].

3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE

4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.

5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

6. ALL GROUND LEADS AND GROUND PADDLE MUST

BE SOLDERED TO PCB RF GROUND.

7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED

PCB LAND PATTERN.

HMC698LP5 / 698LP5E

v03.0709

7 GHz INTEGER N SYNTHESIZER

(N = 12 - 259)