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SSM6J409TU датащи(PDF) 2 Page - Toshiba Semiconductor |
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SSM6J409TU датащи(HTML) 2 Page - Toshiba Semiconductor |
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2 / 6 page ![]() SSM6J409TU 2009-04-08 2 Electrical Characteristics (Ta = 25°C) Characteristic Symbol Test Conditions Min Typ. Max Unit V (BR) DSS ID = -1 mA, VGS = 0 V -20 ⎯ ⎯ Drain-Source breakdown voltage V (BR) DSX ID = -1 mA, VGS = +8 V -12 ⎯ ⎯ V Drain cut-off current IDSS VDS = -20 V, VGS = 0 V ⎯ ⎯ -10 μA Gate leakage current IGSS VGS = ±8 V, VDS = 0 V ⎯ ⎯ ±1 μA Gate threshold voltage Vth VDS = -3 V, ID = -1 mA -0.3 ⎯ -1.0 V Forward transfer admittance ⏐Yfs⏐ VDS = -3 V, ID = -3.0 A (Note 3) 10 20 ⎯ S ID = -3.0 A, VGS = -4.5 V (Note 3) ⎯ 17.8 22.1 ID = -2.0 A, VGS = -2.5 V (Note 3) ⎯ 23.5 30.2 ID = -1.5 A, VGS = -1.8 V (Note 3) ⎯ 31.5 46.2 Drain–source ON-resistance RDS (ON) ID = -0.8 A, VGS = -1.5 V (Note 3) ⎯ 40.0 72.3 m Ω Input capacitance Ciss ⎯ 1100 ⎯ Output capacitance Coss ⎯ 240 ⎯ Reverse transfer capacitance Crss VDS = -10 V, VGS = 0 V, f = 1 MHz ⎯ 180 ⎯ pF Total Gate Charge Qg ⎯ 15.0 ⎯ Gate-Source Charge Qgs ⎯ 10.9 ⎯ Gate-Drain Charge Qgd VDD = −10 V, ID = −9.5 A VGS = −4.5 V ⎯ 4.1 ⎯ nC Turn-on time ton ⎯ 40 ⎯ Switching time Turn-off time toff VDD = -10 V, ID = -2.0 A, VGS = 0 to -2.5 V, RG = 4.7 Ω ⎯ 207 ⎯ ns Drain-Source forward voltage VDSF ID = 9.5 A, VGS = 0 V (Note 3) ⎯ 0.83 1.2 V Note3: Pulse test Switching Time Test Circuit Notice on Usage Vth can be expressed as the voltage between gate and source when the low operating current value is ID = -1 mA for this product. For normal switching operation, VGS (on) requires a higher voltage than Vth and VGS (off) requires a lower voltage than Vth. (The relationship can be established as follows: VGS (off) < Vth < VGS (on).) Take this into consideration when using the device. (c) V tf ton 90% 10% 0 V −2.5 V 90% 10% toff tr VDS (ON) VDD (b) VIN VDD = − 10 V RG = 4.7 Ω D.U. <= 1% VIN: tr, tf < 5 ns Common Source Ta = 25°C VDD OUT IN 0 −2.5 V 10 μs RG ID (a) Test Circuit |
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