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MCP98243 датащи(PDF) 45 Page - Microchip Technology

номер детали MCP98243
подробное описание детали  Memory Module Temperature Sensor w/ EEPROM for SPD
PDF  62 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP98243 датащи(HTML) 45 Page - Microchip Technology

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© 2009 Microchip Technology Inc.
DS22153B-page 45
MCP98243
6.0
APPLICATIONS INFORMATION
6.1
Layout Considerations
The MCP98243 does not require any additional
components besides the master controller in order to
measure temperature. However, it is recommended
that a decoupling capacitor of 0.1 µF to 1 µF be used
between the VDD and GND pins. A high-frequency
ceramic capacitor is recommended. It is necessary for
the capacitor to be located as close as possible to the
power and ground pins of the device in order to provide
effective noise protection.
In addition, good PCB layout is key for better thermal
conduction from the PCB temperature to the sensor
die. For good temperature sensitivity, add a ground
layer under the device pins as shown in Figure 6-1.
6.2
Thermal Considerations
A potential for self-heating errors can exist if the
MCP98243 SDA, SCLK and Event lines are heavily
loaded with pull-ups (high current). Typically, the self-
heating error is negligible because of the relatively
small current consumption of the MCP98243. A
temperature accuracy error of approximately 0.5°C
could result from self-heating if the communication pins
sink/source the maximum current specified.
For example, if the Event output is loaded to maximum
IOL, Equation 6-1 can be used to determine the effect
of self-heating.
EQUATION 6-1:
EFFECT OF SELF-
HEATING
At room temperature (TA = +25°C) with maximum
IDD = 500 µA and VDD = 3.6V, the self-heating due to
power dissipation TΔ is 0.2°C for the DFN-8 package
and 0.5°C for the TSSOP-8 package.
FIGURE 6-1:
DFN Package Layout.
TΔ
θ
JA
V
DD
I
DD
V
OL_Event
I
OL_Event
V
OL_SDA
I
OL_SDA
+
+
()
=
Where:
TΔ =TJ - TA
TJ = Junction Temperature
TA = Ambient Temperature
θJA = Package Thermal Resistance
VOL_Event, SDA = Event and SDA Output VOL
(0.4 Vmax)
IOL_Event, SDA = Event and SDA Output IOL
(3 mAmax)
A0
A1
A2
GND
VDD
Event
SCL
SDA
EP9



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