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MCP1631 датащи(PDF) 8 Page - Microchip Technology

номер детали MCP1631
подробное описание детали  High-Speed, Pulse Width Modulator
PDF  34 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP1631 датащи(HTML) 8 Page - Microchip Technology

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MCP1631/HV/MCP1631V/VHV
DS22063B-page 8
© 2008 Microchip Technology Inc.
TEMPERATURE SPECIFICATIONS
Line Regulation
ΔVOUT/
(VOUTXΔ
VIN)
-0.3
±0.1
+0.3
%/V
(VOUT(MAX) + VDROPOUT(MAX)) ≤
VIN ≤ 16V Note 2
Load Regulation
ΔVOUT/
VOUT
-2.5
±1.0
+2.5
%
IL = 1.0 mA to 250 mA, Note 4
Dropout Voltage
Note 2, Note 5
VDROPOUT
—
330
650
mV
IL = 250 mA, VR = 5.0V
—
525
725
mV
IL = 250 mA, VR = 3.3V
Output Delay Time
TDELAY
—
1000
—
µs
VIN = 0V to 6V, VOUT = 90% VR,
RL = 50Ω resistive
Output Noise
eN
—8
—
µV/
(Hz)1/2
IL = 50 mA, f = 1 kHz, COUT =
1µF
Power Supply Ripple Rejection
Ratio
PSRR
—
44
—
dB
f = 100 Hz, COUT = 1 µF,
IL = 100 µA,
VINAC =100 mV pk-pk,
CIN = 0 µF, VR =1.2V
Protection Features
Thermal Shutdown
TSHD
—
150
—
°C
Thermal Shutdown Hysteresis
TSHD_HYS
—18
—
°C
Electrical Specifications: Unless otherwise indicated, all limits are specified for: VIN + 3.0V to 5.5V
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Operating Junction Temperature
Range
TJ
-40
—
+125
°C
Steady State
Storage Temperature Range
TA
-65
—
+150
°C
Maximum Junction Temperature
TJ
—
—
+150
°C
Transient
Package Thermal Resistances
Thermal Resistance, 20L-TSSOP
θJA
—
90
—
°C/W
Typical 4 Layer board with
interconnecting vias
Thermal Resistance, 20L-SSOP
θJA
—
89.3
—
°C/W
Typical 4 Layer board with
interconnecting vias
Thermal Resistance, 20L-QFN
θJA
—
43
—
°C/W
Typical 4 Layer board with
interconnecting vias
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF,
VDD for typical values = 5.0V, TA for typical values = +25°C, TA = -40°C to +125°C for all minimum and maximums.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Note 1:
External Oscillator Input (OSCIN) rise and fall times between 10 ns and 10 µs were determined during device
characterization testing. Signal levels between 0.8V and 2.0V with rise and fall times measured between 10% and 90%
of maximum and minimum values. Not production tested. Additional timing specifications were fully characterized and
specified that are not production tested.
2:
The minimum VIN must meet two conditions: VIN ≥ 3.5V and VIN ≥ (VOUT(MAX) + VDROPOUT(MAX)).
3:
TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * ΔTemperature), VOUT-HIGH = highest voltage measured over the
temperature range. VOUT-LOW = lowest voltage measured over the temperature range.
4:
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output
voltage due to heating effects are determined using thermal regulation specification TCVOUT.
5:
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured
value with an applied input voltage of VOUT(MAX) + VDROPOUT(MAX) or 3.5V, whichever is greater.



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