MCP6244-ESLASHMS datasheet(33/38 Pages) MICROCHIP

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DS21882D-page 33

MCP6241/1R/1U/2/4

APPENDIX A: REVISION HISTORY

Revision D (October 2008)

The following is the list of modifications:

Changed Heading “Available Tools” to “Design

Aids”.

Design Aids: Name change for Mindi Simulator

Tool.

Package Types: Added DFN to MCP6231

Device.

Absolute

Maximum

Ratings:

Numerous

changes in this section.

Updated notes to

Section 1.0 “Electrical Char-

acteristics”.

Added Figure 2-19.

Numerous

changes

Section 3.0

“Pin

Descriptions”.

Added

Section 4.1.1

“Phase

Reversal”,

Section 4.1.2 “Input Voltage and Current

Limits”, and Section 4.1.3 “Normal Opera-

tion”.

Replaced

Section 5.0 “Design Aids” with

additional information.

10. Added 2x3 DFN package to

Section 6.0 “Pack-

aging Information” and updated Package Out-

line Drawings.

11. Added 2x3 DFN package to

Product Identifica-

tion System section.

Revision C (March 2005)

The following is the list of modifications:

Added the MCP6244 quad op amp.

Re-compensated

parts.

Specifications

that

change are: Gain Bandwidth Product (BWP)

and Phase Margin (PM) in AC Electrical

Characteristics table.

Corrected plots in

Section 2.0 “Typical Perfor-

mance Curves”.

Added

Section 3.0 “Pin Descriptions”.

Added new SC-70 package markings. Added

PDIP-14, SOIC-14, and TSSOP-14 packages

and corrected package marking information

(

Section 6.0 “Packaging Information”).

Added

Appendix A: “Revision History”.

Revision B (August 2004)

Undocumented changes.

Revision A (March 2004)

• Original Release of this Document.

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