Preliminary Datasheet

LP2203

LP2203 – 01 Ver. 1.1 Datasheet

Feb.-2008

Page 7 of 8

temperature 125°C, TA is the ambient temperature and

the θJA is the junction to ambient thermal resistance. For

recommended operating conditions specification of

LP2203, where TJ(MAX) is the maximum junction

temperature of the die (125°C) and TA is the maximum

ambient temperature. The junction to ambient thermal

resistance (θJA is layout dependent) for USP-6 package

is 250°C/W.

PD(MAX) = (125°C−25°C) / 250 = 400mW (USP-6)

PD(MAX) = (125°C−25°C) / 165 = 606mW

The maximum power dissipation depends on operating

ambient temperature for fixed TJ(MAX) and thermal

resistance θJA.