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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MCP3002-I/MS датащи(PDF) 21 Page - Microchip Technology |
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MCP3002-I/MS датащи(HTML) 21 Page - Microchip Technology |
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21 / 34 page  © 2008 Microchip Technology Inc. DS21294D-page 21 MCP3002 6.4 Layout Considerations When laying out a printed circuit board for use with analog components, care should be taken to reduce noise wherever possible. A bypass capacitor should always be used with this device and should be placed as close as possible to the device pin. A bypass capacitor value of 1 µF is recommended. Digital and analog traces should be separated as much as possible on the board and no traces should run underneath the device or the bypass capacitor. Extra precautions should be taken to keep traces with high- frequency signals (such as clock lines) as far as possible from analog traces. Use of an analog ground plane is recommended in order to keep the ground potential the same for all devices on the board. Providing VDD connections to devices in a “star” configuration can also reduce noise by eliminating current return paths and associated errors. See Figure 6-4. For more information on layout tips when using A/D converters, refer to AN-688 “Layout Tips for 12-Bit A/D Converter Applications”. FIGURE 6-4: VDD traces arranged in a ‘Star’ configuration in order to reduce errors caused by current return paths. VDD Connection Device 1 Device 2 Device 3 Device 4 |
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