MCP606 datasheet(5/42 Pages) MICROCHIP

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DS11177F-page 5

MCP606/7/8/9

TEMPERATURE CHARACTERISTICS

1.1

Test Circuits

The test circuits used for the DC and AC tests are

shown in Figure 1-2 and Figure 1-3. The bypass

capacitors are laid out according to the rules discussed

Section 4.5 “Supply Bypass”.

FIGURE 1-2:

AC and DC Test Circuit for

Most Non-Inverting Gain Conditions.

FIGURE 1-3:

AC and DC Test Circuit for

Most Inverting Gain Conditions.

Electrical Characteristics: Unless otherwise indicated, V

DD = +2.5V to +5.5V and VSS = GND.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Temperature Ranges

Specified Temperature Range

-40

—

+85

°C

Operating Temperature Range

-40

—

+125

°C

Note 1

Storage Temperature Range

-65

—

+150

°C

Thermal Package Resistances

Thermal Resistance, 5L-SOT23

—

220.7

—

°C/W

Thermal Resistance, 8L-PDIP

—89.3

—

°C/W

Thermal Resistance, 8L-SOIC

—

149.5

—

°C/W

Thermal Resistance, 8L-TSSOP

—

139

—

°C/W

Thermal Resistance, 14L-PDIP

—70

—

°C/W

Thermal Resistance, 14L-SOIC

—95.3

—

°C/W

Thermal Resistance, 14L-TSSOP

—

100

—

°C/W

Note 1:

The MCP606/7/8/9 operate over this extended temperature range, but with reduced performance. In any case, the

Junction Temperature (TJ) must not exceed the Absolute Maximum specification of +150°C.

VDD

VOUT

VIN

VDD/2

1µF

0.1 µF

MCP60X

VDD

VOUT

VDD/2

VIN

1µF

0.1 µF

MCP60X

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