ADCLK950SLASHPCBZ datasheet(5/12 Pages) AD

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ADCLK950

Rev. 0 | Page 5 of

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

Supply Voltage

VCC − VEE

6 V

Input Voltage

CLK0, CLK1, CLK0, CLK1, IN_SEL

VEE − 0.5 V to

VCC + 0.5 V

CLK0, CLK1, CLK0, CLK1 to VTx Pin (CML,

LVPECL Termination)

±40 mA

CLK0, CLK1 to CLK0, CLK1

±1.8 V

Input Termination, VTx to CLK0, CLK1, CLK0,

and CLK1

±2 V

Maximum Voltage on Output Pins

VCC + 0.5 V

Maximum Output Current

35 mA

Voltage Reference (VREFx)

VCC to VEE

Operating Temperature Range

Ambient

−40°C to +85°C

Junction

150°C

Storage Temperature Range

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

DETERMINING JUNCTION TEMPERATURE

To determine the junction temperature on the application

printed circuit board (PCB), use the following equation:

TJ = TCASE + (ΨJT × PD)

where:

TJ is the junction temperature (°C).

TCASE is the case temperature (°C) measured by the customer at

the top center of the package.

is from Table 6.

PD is the power dissipation.

Values of θJA are provided for package comparison and PCB

design considerations. θJA can be used for a first-order approxi-

mation of TJ by the equation

TJ = TA + (θJA × PD)

where TA is the ambient temperature (°C).

Values of θJB are provided in Table 6 for package comparison

and PCB design considerations.

ESD CAUTION

THERMAL PERFORMANCE

Table 6.

Parameter

Symbol

Description

Value1

Unit

Junction-to-Ambient Thermal Resistance

Still Air

Per JEDEC JESD51-2

0 m/sec Air Flow

46.1

°C/W

Moving Air

JMA

Per JEDEC JESD51-6

1 m/sec Air Flow

40.3

°C/W

2.5 m/sec Air Flow

36.2

°C/W

Junction-to-Board Thermal Resistance

Moving Air

Per JEDEC JESD51-8

1 m/sec Air Flow

28.7

°C/W

Junction-to-Case Thermal Resistance

Moving Air

Per MIL-STD 883, Method 1012.1

Die-to-Heatsink

8.3

°C/W

Junction-to-Top-of-Package Characterization Parameter

Still Air

Per JEDEC JESD51-2

0 m/sec Air Flow

0.6

°C/W

1 Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the

application to determine if they are similar to those assumed in these calculations.

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