AD8278ARZ-R7 datasheet(7/24 Pages) AD

7 / 24 page

AD8278

Rev. 0 | Page 7 of 24

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

Supply Voltage

±18 V

Maximum Voltage at Any Input Pin

−VS + 40 V

Minimum Voltage at Any Input Pin

+VS − 40 V

Storage Temperature Range

−65°C to +150°C

Specified Temperature Range

−40°C to +85°C

Package Glass Transition Temperature (TG)

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

The θJA values in Table 7 assume a 4-layer JEDEC standard

board with zero airflow.

Table 7. Thermal Resistance

Package Type

θJA

Unit

8-Lead MSOP

135

°C/W

8-Lead SOIC

121

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the AD8278 is limited

by the associated rise in junction temperature (TJ) on the die. At

approximately 150°C, which is the glass transition temperature,

the properties of the plastic change. Even temporarily exceeding

this temperature limit may change the stresses that the package

exerts on the die, permanently shifting the parametric performance

of the amplifiers. Exceeding a temperature of 150°C for an

extended period may result in a loss of functionality.

2.0

1.6

1.2

0.8

0.4

–50

–25

255075

100

125

AMBIENT TEMERATURE (°C)

TJ MAX = 150°C

MSOP

θJA = 135°C/W

SOIC

θJA = 121°C/W

Figure 2. Maximum Power Dissipation vs. Ambient Temperature

SHORT-CIRCUIT CURRENT

The AD8278 has built-in, short-circuit protection that limits the

output current (see Figure 27 for more information). While the

short-circuit condition itself does not damage the part, the heat

generated by the condition can cause the part to exceed its

maximum junction temperature, with corresponding negative

effects on reliability. Figure 2 and Figure 27, combined with

knowledge of the supply voltages and ambient temperature of the

part can be used to determine whether a short circuit will cause

the part to exceed its maximum junction temperature.

ESD CAUTION

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