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V•I Chip Bus Converter Module

B048F030T21

Rev. 2.6

Page 1 of 12

V•I

Parameter

Values

Unit

Notes

+In to -In

-1.0 to 60

Vdc

+In to -In

100

Vdc

For 100 ms

PC to -In

-0.3 to 7.0

Vdc

+Out to -Out

-0.5 to 6.0

Vdc

Isolation voltage

2,250

Vdc

Input to output

Output current

70

A

Continuous

Peak output current

105.0

A

For 1 ms

Output power

210

W

Continuous

Peak output power

315

W

For 1 ms

Case temperature

225

°C

During reflow MSL 5

Operating junction temperature

(1)

-40 to 125

°C

T-Grade

-55 to 125

°C

M-Grade

Storage temperature

-40 to 125

°C

T-Grade

-65 to 125

°C

M-Grade

• 48 V to 3 V V•I Chip

• 210 Watt (315 Watt for 1 ms)

• Low weight – 0.5 oz (15 g)

• ZVS / ZCS isolated Sine

Amplitude Converter

• Typical efficiency 95%

• <1 µs transient response

• 3.5 million hours MTBF

• No output filtering required

B048F030T21

Vin = 38 - 55 V

Vout = 2.38 - 3.43 V

Iout = 70 A

K = 1/16

Rout = 2.0 mΩ max

©

Bus Converter

Output Power

Designator

B

048

F

030

T

21

Bus Converter

Module

Input Voltage

Designator

Product Grade Temperatures (°C)

Grade

Storage

T

-40 to125

-40 to125

M

-65 to 125

-55 to 125

Configuration

F = J-lead

T = Through hole

Output Voltage

Designator

Note:

(1) The referenced junction is defined as the semiconductor having the highest temperature.

This temperature is monitored by a shutdown comparator.

Product Description

The V•I Chip Bus Converter Module is a high efficiency

(>95%), narrow input range Sine Amplitude Converter

(SAC) operating from a 38 to 55 Vdc primary bus to

deliver an isolated 2.38 V to 3.43 V secondary. The BCM

may be used to power non-isolated POL converters or as

an independent 2.38 – 3.43 V source. Due to the fast

response time and low noise of the BCM, the need for

limited life aluminum electrolytic or tantalum capacitors

at the load is reduced—or eliminated—resulting in

savings of board area, materials and total system cost.

V•I Chip package compatible with standard pick-and-

place and surface mount assembly process. The V•I Chip

package provides flexible thermal management through

its low junction-to-board and junction-to-case thermal

resistance. Owing to its high conversion efficiency and

safe operating temperature range, the BCM does not

require a discrete heat sink in typical applications. Low

junction-to-case and junction-to-lead thermal

impedances assure low junction temperatures and long

life in the harshest environments.

B048F030M21

Absolute Maximum Ratings

Part Numbering