UCC561 datasheet(2/8 Pages) TI

2 / 8 page

UCC561

SLUS413B -- MAY 1999 -- REVISED NOVEMBER 2002

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate

precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION

PRODUCT

PACKAGE--LEAD

PACKAGE

DESIGNATOR

SPECIFIED

TEMPERATURE

RANGE

ORDERING

NUMBER

TRANSPORT MEDIA,

QUANTITY

UCC561

SOIC--16

0°Cto 70°C

UCC561DP

Rail, 70

(1) For the most current specification and package information, refer to our web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)(2)

UCC561

UNIT

TERMPWR

Package dissipation

1.2

Junction temperature, TJ

--55 to 150

°C

Storage temperature, Tstg

--65 to 150

°C

(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) Currents are positive into and negative out of the specified terminals.

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX UNIT

VTERMPWR, TermPower voltage

2.70

5.25

TERMPWR

REG2

HSPGND

HSGND

REG1

DIFSENS

HSGND

DP PACKAGE

(TOP VIEW)

NC = No connection

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