TRF8010

900-MHz RF TRANSMIT DRIVER

SLWS031B – JULY 1996– REVISED MAY 1997

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POST OFFICE BOX 655303

Supplies for AMPS/NADC and GSM

Applications Respectively

800 MHz to 1000 MHz

in AMPS/NADC and GSM Applications

Respectively

for Low-Power Consumption, High

Efficiency, and Highly Linear Operation

Required for Operation

Package for Extremely Small Circuit

Footprint

description

The TRF8010 is an RF transmit driver amplifier for 900-MHz digital, analog, and dual-mode communication

applications. It consists of a two-stage amplifier and a linear ramp controller for burst control in TDMA (time

division multiple access) applications. Very few external components are required for operation.

The TRF8010 amplifies the RF signal from the preceding modulator and upconverter stages in an RF section

of a transmitter to a level that is sufficient to drive a final RF power output device. The output impedance of

RFOUT is approximately 50

Ω. But, since RFOUT is connected to an open-collector output device, minimal

external matching is required.

The device is enabled when the TXEN input is held high. A power control signal applied to the VPC input can

ramp the RF output power up or down to meet ramp and spurious emission specifications in TDMA systems.

The power control signal causes a linear change in output power as the voltage applied to VPC varies between

0 V and 3 V. With the RF input power applied to RFIN at 0 dBm and TXEN high, adjusting VPC from 0 V to

3 V increases the output power from a typical value of –54 dBm at VPC = 0 V to the output power appropriate

for the application:

operation

Forward isolation with the RF input power applied to RFIN at 0 dBm, VPC = 0 V, and TXEN high is typically

greater than 50 dB.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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GND

GND

RFIN

GND

NC

VPC

GND

NC

GND

GND

GND

RFOUT

GND

GND

TXEN

GND

GND

PWP PACKAGE

(TOP VIEW)

NC – No internal connection

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Copyright

© 1997, Texas Instruments Incorporated