TPA0232

STEREO 2-W AUDIO POWER AMPLIFIER

WITH DC VOLUME CONTROL AND MUX CONTROL

SLOS286 – NOVEMBER 1999

1

POST OFFICE BOX 655303

Into 10-k

Ω Load

Load

External Gain-Setting Resistors

24-Pin TSSOP PowerPAD

™

description

The TPA0232 is a stereo audio power amplifier in a 24-pin TSSOP thermally enhanced package capable of

delivering 2 W of continuous RMS power per channel into 3-

Ω loads. This device minimizes the number of

external components needed, which simplifies the design and frees up board space for other features. When

driving 1 W into 8-

Ω speakers, the TPA0232 has less than 0.4% THD+N across its specified frequency range.

Included within this device is integrated depop circuitry that virtually eliminates transients that cause noise in

the speakers.

Amplifier gain is controlled by means of a dc voltage input on the VOLUME terminal. There are 31 discrete steps

covering the range of +20 dB (maximum volume setting) to –40 dB (minimum volume setting) in 2 dB steps.

When the VOLUME terminal exceeds 3.54 V, the device is muted. An internal input MUX allows two sets of

stereo inputs to the amplifier. The HP/LINE terminal allows the user to select which MUX input is active

regardless of whether the amplifier is in SE or BTL mode. In notebook applications, where internal speakers

are driven as BTL and the line outputs (often headphone drive) are required to be SE, the TPA0232

automatically switches into SE mode when the SE/BTL input is activated, and this effectively reduces the gain

by 6 dB.

The TPA0232 consumes only 10 mA of supply current during normal operation. A miserly shutdown mode

reduces the supply current to less than 150

µA.

The PowerPAD package (PWP) delivers a level of thermal performance that was previously achievable only

in TO-220-type packages. Thermal impedances of approximately 35

°C/W are readily realized in multilayer PCB

applications. This allows the TPA0232 to operate at full power into 8-

Ω loads at ambient temperatures of 85°C.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Copyright

© 1999, Texas Instruments Incorporated

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

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PWP PACKAGE

(TOP VIEW)

GND

HP/LINE

VOLUME

LOUT+

LLINEIN

LHPIN

RIN

LOUT–

LIN

BYPASS

GND

GND

RLINEIN

SHUTDOWN

ROUT+

RHPIN

CLK

ROUT–

SE/BTL

PC-BEEP

GND

PowerPAD is a trademark of Texas Instruments Incorporated.